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RK3399
典型應(yīng)用方向
主要特性
- Dual-core Cortex-A72 up to 1.8GHz
Quad-core Cortex-A53 up to 1.4GHz - Mali-T860 GPU
- Dual-channel DDR3/DDR3L/LPDDR3/LPDDR4
- 4K UHD H265/H264/VP9
- HDR10/HLG
- H264 encoder
- Dual MIPI CSI and ISP
- Dual USB Type-C and USB 2.0
- HDMI 2.0a with HDCP 2.2
- MIPI/eDP/RGMII/DP/PCIe
- TrustZone/TEE/DRM
SPECIFICATIONS | |
CPU | • Big.Little architecture: Dual Cortex-A72 + Quad Cortex-A53, 64-bit CPU |
• Frequency is up to 1.8GHz | |
GPU | • Mali-T860 GPU, OpenGL ES1.1/2.0/3.0/3.1, OpenCL |
• Supports AFBC (ARM Frame Buffer Compression) | |
Memory | • Dual channel DDR3-1866/DDR3L-1866/LPDDR3-1866/LPDDR4 |
• Support eMMC 5.1 with HS400, SDIO 3.0 with HS200 | |
Multi-Media | • 4K VP9 and 4K 10bits H265/H264 video decoders, up to 60fps |
• 1080P other video decoders (VC-1, MPEG-1/2/4, VP8) | |
• 1080P video encoders for H.264 and VP8 | |
• Video post processor: de-interlace, de-noise, enhancement for edge/detail/color | |
Display | • Dual VOP: one supports 4096x2160 with AFBC supported; the other supports 2560x1600 |
• Dual channel MIPI-DSI (4 lanes per channel) | |
• eDP 1.3 (4 lanes with 10.8Gbps) to support display, with PSR | |
• HDMI 2.0a for 4K 60Hz with HDCP 1.4/2.2 | |
• DisplayPort 1.2 (4 lanes, up to 4K 60Hz) | |
• Supports Rec.2020 and conversion to Rec.709 | |
interface | • Dual 13M ISP and dual channel MIPI CSI-2 receive interface |
• Dual USB 3.0 with type-C supported | |
• PCIe 2.1 (4 full-duplex lanes ) | |
• Embedded low power MCU for other application | |
• 8 channels I2S supports 8 channels RX or 8 channels TX | |
Package | • FCBGA828 21mmx21mm ,0.65mm pitch |
State | • MP Now |