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RK2206
典型應(yīng)用方向
主要特性
- Cortex-M4F Up To 200MHz
- Tensilica HiFi3 DSP Up To 300MHz
- Built-in 448K Byte SRAM & DTCM
- Embedded 8M/4M Byte FLASH & PSRAM
- WLAN 802.11 b/g/n
SPECIFICATIONS | |
CPU | • Cortex-M4F Up To 200MHz |
DSP | • Tensilica HiFi3 DSP Up To 300MHz |
Memory | • Built-in 256KB SRAM,192KB DTCM |
• Built-in 8/4 MB Flash | |
• Built-in 8/4 MB PSRAM | |
• Support EMMC,SD/MMC Card | |
Audio ADC | • 3CH Audio-ADC,1CH Audio-DAC (With-in RK812) |
• Class D Audio PA(With-in RK812) | |
Connectivity | • Built-in Power Management(With-in RK812) |
• DVP Sensor Interface | |
• USB2.0 OTG, SPI, UART,I2C,PDM, I2S | |
Display | • MCU/SPI LCD Interface |
Audio | • Multi-format audio encoder & decoder |
OS | • Free RTOS |